Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Nisha Ananthakrishnan, Arjun Krishnan | 2017-07-11 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Arjun Krishnan | 2017-04-04 |