Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and materials for warpage thermal and interconnect solutions

Method and materials for warpage thermal and interconnect solutions

US Patent 9607964 · Granted Mar 28, 2017

Estimated economic value: $8,391,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced bridge structure for a photonic integrated circuit2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Ultra-thin, hyper-density semiconductor packages2025