Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812422 | Embedded die-down package-on-package device | Toong Erh Ooi, Bok Eng Cheah | 2017-11-07 |
| 9793244 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Bassam M. Ziadeh | 2017-10-17 |