Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839134 | Flexible integrated circuit that includes an antenna | Boon Ping Koh | 2017-12-05 |
| 9812422 | Embedded die-down package-on-package device | Toong Erh Ooi, Nitesh Nimkar | 2017-11-07 |
| 9812425 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Shanggar Periaman, Kooi Chi Ooi, Jackson Chung Peng Kong | 2017-11-07 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more | 2017-10-03 |
| 9721878 | High density second level interconnection for bumpless build up layer (BBUL) packaging technology | Shanggar Periaman, Kooi Chi Ooi | 2017-08-01 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Jackson Chung Peng Kong, Kooi Chi Ooi, Shanggar Periaman, Michael P. Skinner | 2017-05-09 |
| 9552995 | Electrical interconnect for an electronic package | Khang Choong Yong, Teong Keat Beh, Howard L. Heck, Jackson Chung Peng Kong, Stephen H. Hall +1 more | 2017-01-24 |