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Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same |
Bok Eng Cheah, Shanggar Periaman, Jackson Chung Peng Kong |
2017-11-07 |
| 9778688 |
Flexible system-in-package solutions for wearable devices |
Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more |
2017-10-03 |
| 9721878 |
High density second level interconnection for bumpless build up layer (BBUL) packaging technology |
Bok Eng Cheah, Shanggar Periaman |
2017-08-01 |
| 9646953 |
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices |
Jackson Chung Peng Kong, Bok Eng Cheah, Shanggar Periaman, Michael P. Skinner |
2017-05-09 |
| 9552995 |
Electrical interconnect for an electronic package |
Khang Choong Yong, Bok Eng Cheah, Teong Keat Beh, Howard L. Heck, Jackson Chung Peng Kong +1 more |
2017-01-24 |