Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812425 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Bok Eng Cheah, Kooi Chi Ooi, Jackson Chung Peng Kong | 2017-11-07 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more | 2017-10-03 |
| 9721878 | High density second level interconnection for bumpless build up layer (BBUL) packaging technology | Bok Eng Cheah, Kooi Chi Ooi | 2017-08-01 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi, Michael P. Skinner | 2017-05-09 |