Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9692402 | Method, apparatus, system for centering in a high performance interconnect | Mahesh Wagh, Zuoguo Wu, Venkatraman Iyer, Gerald Pasdast, David M. Lee +1 more | 2017-06-27 |
| 9660364 | System interconnect for integrated circuits | Timothy Wig, Sanka Ganesan | 2017-05-23 |
| 9536863 | Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces | Zuoguo Wu, Aaron Martin, Andrew Martwick, John B. Halbert | 2017-01-03 |