VI

Venkatraman Iyer

IN Intel: 10 patents #172 of 5,604Top 4%
Overall (2017): #6,572 of 506,227Top 2%
10
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9817054 Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing Thanunathan Rangarajan, Shreesh Chhabbi, Arvind Kumar 2017-11-14
9779053 Physical interface for a serial interconnect Debendra Das Sharma, Daniel S. Froelich, Michelle C. Jen, Rahul R. Shah, Eric M. Lee 2017-10-03
9697158 High performance interconnect physical layer Darren S. Jue, Jeff Willey, Robert G. Blankenship 2017-07-04
9692402 Method, apparatus, system for centering in a high performance interconnect Mahesh Wagh, Zuoguo Wu, Gerald Pasdast, Todd Hinck, David M. Lee +1 more 2017-06-27
9692589 Redriver link testing Fulvio Spagna, Debendra Das Sharma 2017-06-27
9626321 High performance interconnect Robert J. Safranek, Robert G. Blankenship, Jeff Willey, Robert Beers, Darren S. Jue +18 more 2017-04-18
9612986 High performance interconnect physical layer Darren S. Jue, Sitaraman V. Iyer 2017-04-04
9600431 High performance interconnect physical layer Darren S. Jue, Sitaraman V. Iyer 2017-03-21
9588575 Link power savings with state retention Naveen Cherukuri, Jeffrey R. Wilcox, Selim Bilgin, David S. Dunning, Robin Tim Frodsham +2 more 2017-03-07
9552253 Probabilistic flit error checking Robert G. Blankenship, Debendra Das Sharma 2017-01-24