Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817054 | Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing | Thanunathan Rangarajan, Arvind Kumar, Venkatraman Iyer | 2017-11-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817054 | Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing | Thanunathan Rangarajan, Arvind Kumar, Venkatraman Iyer | 2017-11-14 |