Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9692402 | Method, apparatus, system for centering in a high performance interconnect | Mahesh Wagh, Venkatraman Iyer, Gerald Pasdast, Todd Hinck, David M. Lee +1 more | 2017-06-27 | $7,334,000 |
| 9536863 | Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces | Todd Hinck, Aaron Martin, Andrew Martwick, John B. Halbert | 2017-01-03 | $8,191,000 |