HC

Harold Ryan Chase

IN Intel: 1 patents #2,217 of 5,604Top 40%
Overall (2017): #409,455 of 506,227Top 85%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9741686 Electronic package and method of connecting a first die to a second die to form an electronic package Mathew J. Manusharow, Mihir K. Roy 2017-08-22