Issued Patents 2002
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489233 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Sangki Hong | 2002-12-03 |
| 6486080 | Method to form zirconium oxide and hafnium oxide for high dielectric constant materials | Simon Chooi, Wenhe Lin | 2002-11-26 |
| 6479383 | Method for selective removal of unreacted metal after silicidation | Simon Chooi | 2002-11-12 |
| 6475908 | Dual metal gate process: metals and their silicides | Wenhe Lin, Kin Leong Pey, Simon Chooi | 2002-11-05 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Yi Xu +2 more | 2002-11-05 |
| 6468851 | Method of fabricating CMOS device with dual gate electrode | Chew Hoe Ang, Eng Hua Lim, Randall Cher Liang Cha, Jia Zhen Zheng, Elgin Quek +1 more | 2002-10-22 |
| 6465888 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Subhash Gupta, Sang-Ki Hong | 2002-10-15 |
| 6465157 | Dual layer pattern formation method for dual damascene interconnect | Jianxun Li, Subhash Gupta, Ming hui Far | 2002-10-15 |
| 6461969 | Multiple-step plasma etching process for silicon nitride | Pei Ching Lee, Wen-Jun Liu | 2002-10-08 |
| 6458695 | Methods to form dual metal gates by incorporating metals and their conductive oxides | Wenhe Lin, Kin Leong Pey, Simon Chooi | 2002-10-01 |
| 6451706 | Attenuation of reflecting lights by surface treatment | Ron Fu Chu, Yang Pan, Qun Ying Lin | 2002-09-17 |
| 6436824 | Low dielectric constant materials for copper damascene | Simon Chooi, Yi Xu | 2002-08-20 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-08-06 |
| 6429129 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Licheng M. Han, Xu Yi, Simon Chooi, Joseph Xie | 2002-08-06 |
| 6429122 | Non metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Sangki Hong | 2002-08-06 |
| 6429109 | Method to form high k dielectric and silicide to reduce poly depletion by using a sacrificial metal between oxide and gate | Jia Zhen Zheng, Elgin Quek, Daniel Yen, Chew Hoe Ang, Eng Hua Lim +1 more | 2002-08-06 |
| 6424044 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Xu Yi, Joseph Xie, Simon Chooi | 2002-07-23 |
| 6419754 | Endpoint detection and novel chemicals in copper stripping | Simon Chooi | 2002-07-16 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6394114 | Method for stripping copper in damascene interconnects | Subhash Gupta, Simon Chooi, Paul Ho | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6387765 | Method for forming an extended metal gate using a damascene process | Vijai Kumar Chhagan, Yelehanka Ramachandramurthy Pradeep, Henry Gerung, Simon Chooi | 2002-05-14 |
| 6383922 | Thermal stability improvement of CoSi2 film by stuffing in titanium | Bei Chao Zhang, Chung Woh Lai, Eng Hua Lim, Peter Chew, Arthur Ang | 2002-05-07 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, John Sudijono +2 more | 2002-04-30 |