Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429129 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Licheng M. Han, Simon Chooi, Mei Sheng Zhou, Joseph Xie | 2002-08-06 |
| 6424044 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-07-23 |
| 6375857 | Method to form fuse using polymeric films | Chit Hwei Ng, Sanford Chu | 2002-04-23 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Yakub Aliyu +2 more | 2002-03-19 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2002-01-22 |