Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500771 | Method of high-density plasma boron-containing silicate glass film deposition | Vladislav Vassiliev, Alan Cuthbertson | 2002-12-31 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Yi Xu +2 more | 2002-11-05 |
| 6451687 | Intermetal dielectric layer for integrated circuits | Huang Liu, Juan Boon Tan, Edwin Goh, Alan Cuthbertson, Arthur Ang +3 more | 2002-09-17 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-08-06 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-07-09 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-04-30 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-03-19 |
| 6355581 | Gas-phase additives for an enhancement of lateral etch component during high density plasma film deposition to improve film gap-fill capability | Vladislav Vassiliev, Yelehanka Ramachandramurthy Pradeep, Jie Yu | 2002-03-12 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, Subhash Gupta +2 more | 2002-02-26 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-01-22 |