Issued Patents 2002
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-11-05 |
| 6436824 | Low dielectric constant materials for copper damascene | Simon Chooi, Mei Sheng Zhou | 2002-08-20 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-08-06 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Mei Sheng Zhou, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6395631 | Low dielectric constant dielectric layer fabrication method employing hard mask layer delamination | Jian Xun Li | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-04-30 |
| 6358842 | Method to form damascene interconnects with sidewall passivation to protect organic dielectrics | Mei Sheng Zhou, Simon Chooi | 2002-03-19 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-03-05 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-02-26 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Mei Sheng Zhou, Subhash Gupta | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Subhash Gupta, Simon Chooi, Mei Sheng Zhou | 2002-02-19 |