Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6387859 | Method and cleaner composition for stripping copper containing residue layers | — | 2002-05-14 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-04-30 |