Issued Patents 2002
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489233 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-12-03 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy, Paul Ho, Yi Xu +2 more | 2002-11-05 |
| 6465157 | Dual layer pattern formation method for dual damascene interconnect | Jianxun Li, Mei Sheng Zhou, Ming hui Far | 2002-10-15 |
| 6465888 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Mei Sheng Zhou, Sang-Ki Hong | 2002-10-15 |
| 6429122 | Non metallic barrier formations for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-08-06 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Sudipto Ranendra Roy +2 more | 2002-08-06 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-07-09 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu +2 more | 2002-07-09 |
| 6394114 | Method for stripping copper in damascene interconnects | Simon Chooi, Paul Ho, Mei Sheng Zhou | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6391732 | Method to form self-aligned, L-shaped sidewall spacers | Yelehanka Ramachandramurthy, Vijai Kumar Chhagan | 2002-05-21 |
| 6380084 | Method to form high performance copper damascene interconnects by de-coupling via and metal line filling | Yeow Kheng Lim, Alex See, Cher Liang Cha, Wang Ling Goh, Man Siu Tse | 2002-04-30 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-04-30 |
| 6380087 | CMP process utilizing dummy plugs in damascene process | Mei Sheng Zhou, Ramasamy Chockalingam | 2002-04-30 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-04-16 |
| 6368958 | Method to deposit a cooper seed layer for dual damascence interconnects | Paul Ho, Mei Sheng Zhou, Simon Chooi | 2002-04-09 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6365320 | Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography | David K. Foote | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi, Yakub Aliyu +2 more | 2002-03-19 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Mei Sheng Zhou, Simon Chooi, Sangki Hong | 2002-03-05 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Mei Sheng Zhou, Yi Xu | 2002-02-26 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Yi Xu, Simon Chooi, Mei Sheng Zhou | 2002-02-19 |
| 6346468 | Method for forming an L-shaped spacer using a disposable polysilicon spacer | Yelehanka Ramachandramurthy Pradeep, Vijai Chhagan | 2002-02-12 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2002-01-22 |