Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472697 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Randall Cher Liang Cha, Alex See, Wang Ling Goh, Victor Lim | 2002-10-29 |
| 6468880 | Method for fabricating complementary silicon on insulator devices using wafer bonding | Randall Cher Liang Cha, Alex See, Tae Jong Lee, Wang Ling Goh | 2002-10-22 |
| 6432797 | Simplified method to reduce or eliminate STI oxide divots | Randall Cher Liang Cha, Tae Jong Lee, Alex See, Lap Chan | 2002-08-13 |
| 6399471 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Randall Cher Liang Cha, Alex See, Wang Ling Goh, Victor Lim | 2002-06-04 |
| 6380084 | Method to form high performance copper damascene interconnects by de-coupling via and metal line filling | Alex See, Cher Liang Cha, Subhash Gupta, Wang Ling Goh, Man Siu Tse | 2002-04-30 |
| 6355563 | Versatile copper-wiring layout design with low-k dielectric integration | Randall Cher Liang Cha, Alex See, Tae Jong Lee, Lap Chan | 2002-03-12 |