Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472697 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Victor Lim | 2002-10-29 |
| 6468880 | Method for fabricating complementary silicon on insulator devices using wafer bonding | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Tae Jong Lee | 2002-10-22 |
| 6403484 | Method to achieve STI planarization | Victor Lim, Lap Chan, James Yong Meng Lee, Chen Feng | 2002-06-11 |
| 6399471 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Victor Lim | 2002-06-04 |
| 6380084 | Method to form high performance copper damascene interconnects by de-coupling via and metal line filling | Yeow Kheng Lim, Alex See, Cher Liang Cha, Subhash Gupta, Man Siu Tse | 2002-04-30 |
| 6376376 | Method to prevent CU dishing during damascene formation | Victor Lim, Feng Chen | 2002-04-23 |