Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6380084 | Method to form high performance copper damascene interconnects by de-coupling via and metal line filling | Yeow Kheng Lim, Alex See, Cher Liang Cha, Subhash Gupta, Wang Ling Goh | 2002-04-30 |