Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472697 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Wang Ling Goh | 2002-10-29 |
| 6406975 | Method for fabricating an air gap shallow trench isolation (STI) structure | Young Way Teh, Ting Cheong Ang, Alex See, Yong Kong Siew | 2002-06-18 |
| 6403484 | Method to achieve STI planarization | Lap Chan, James Yong Meng Lee, Chen Feng, Wang Ling Goh | 2002-06-11 |
| 6399471 | Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application | Yeow Kheng Lim, Randall Cher Liang Cha, Alex See, Wang Ling Goh | 2002-06-04 |
| 6376376 | Method to prevent CU dishing during damascene formation | Feng Chen, Wang Ling Goh | 2002-04-23 |