Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489233 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-12-03 |
| 6429122 | Non metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-08-06 |
| 6376353 | Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects | Mei Sheng Zhou, Simon Chooi | 2002-04-23 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-04-16 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Subhash Gupta, Mei Sheng Zhou, Simon Chooi | 2002-03-05 |