SR

Sudipto Ranendra Roy

CM Chartered Semiconductor Manufacturing: 10 patents #18 of 191Top 10%
📍 Dallas, TX: #3 of 498 inventorsTop 1%
🗺 Texas: #61 of 8,590 inventorsTop 1%
Overall (2002): #1,525 of 266,432Top 1%
10
Patents 2002

Issued Patents 2002

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
6475810 Method of manufacturing embedded organic stop layer for dual damascene patterning Mei Sheng Zhou, John Sudijono, Subhash Gupta, Paul Ho, Yi Xu +2 more 2002-11-05
6429117 Method to create copper traps by modifying treatment on the dielectrics surface John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more 2002-08-06
6415973 Method of application of copper solution in flip-chip, COB, and micrometal bonding Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, Yakub Aliyu +2 more 2002-07-09
6417088 Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding Kwok Keung Paul Ho, Yi Xu, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou +2 more 2002-07-09
6391783 Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more 2002-05-21
6378759 Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more 2002-04-30
6365508 Process without post-etch cleaning-converting polymer and by-products into an inert layer Mei Sheng Zhou, John Sudijono, Subhash Gupta, Paul Ho, Xu Yi +2 more 2002-04-02
6358821 Method of copper transport prevention by a sputtered gettering layer on backside of wafer Subhash Gupta, Simon Chooi, Paul Ho, Xu Yi, Yakub Aliyu +2 more 2002-03-19
6350689 Method to remove copper contamination by using downstream oxygen and chelating agent plasma Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more 2002-02-26
6340608 Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more 2002-01-22