Issued Patents 2002
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6380087 | CMP process utilizing dummy plugs in damascene process | Subhash Gupta, Ramasamy Chockalingam | 2002-04-30 |
| 6376353 | Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects | Sangki Hong, Simon Chooi | 2002-04-23 |
| 6376361 | Method to remove excess metal in the formation of damascene and dual interconnects | Simon Chooi, Tak Yan Tse | 2002-04-23 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Subhash Gupta, Sangki Hong | 2002-04-16 |
| 6368958 | Method to deposit a cooper seed layer for dual damascence interconnects | Paul Ho, Subhash Gupta, Simon Chooi | 2002-04-09 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6358842 | Method to form damascene interconnects with sidewall passivation to protect organic dielectrics | Simon Chooi, Yi Xu | 2002-03-19 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Subhash Gupta, Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-03-19 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Yi Xu, Joseph Xie, Simon Chooi | 2002-03-05 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Subhash Gupta, Simon Chooi, Sangki Hong | 2002-03-05 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta +2 more | 2002-02-26 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Subhash Gupta, Yi Xu | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Subhash Gupta, Yi Xu, Simon Chooi | 2002-02-19 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2002-01-22 |