Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485359 | Platen arrangement for a chemical-mechanical planarization apparatus | Shijian Li, John M. White, Manoocher Birang | 2002-11-26 |
| 6468362 | Method and apparatus for cleaning/drying hydrophobic wafers | Youfel Chen, Brian J. Brown, Boris Fishkin | 2002-10-22 |
| 6465051 | Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling | Turgut Sahin, Romuald Nowak, Shijian Li, Timothy Dyer, Derek R. Witty | 2002-10-15 |
| 6435944 | CMP slurry for planarizing metals | Yuchun Wang, Rajeev Bajaj | 2002-08-20 |
| 6435942 | Chemical mechanical polishing processes and components | Raymond R. Jin, Jeffrey Drue David, Thomas H. Osterheld | 2002-08-20 |
| 6436302 | Post CU CMP polishing for reduced defects | Juy-Lung Li, Tse-Yong Yao, Rajeev Bajaj, Yutao Ma | 2002-08-20 |
| 6436832 | Method to reduce polish initiation time in a polish process | Yutao Ma, Juilung Li, Tse-Yong Yao, Rajeev Bajaj | 2002-08-20 |
| 6432826 | Planarized Cu cleaning for reduced defects | Ramin Emami, Shijian Li, Sen-Hou Ko, Madhavi R. Chandrachood | 2002-08-13 |
| 6416823 | Deposition chamber and method for depositing low dielectric constant films | Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins | 2002-07-09 |
| 6379223 | Method and apparatus for electrochemical-mechanical planarization | Lizhong Sun, Stan Tsai | 2002-04-30 |
| 6358124 | Pad conditioner cleaning apparatus | Raijiro Koga, Hiromi Tsuruta, Takashi Kumagai, Gee Sun Hoey, Brian J. Brown +5 more | 2002-03-19 |