Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6435944 | CMP slurry for planarizing metals | Yuchun Wang, Fred C. Redeker | 2002-08-20 |
| 6436302 | Post CU CMP polishing for reduced defects | Juy-Lung Li, Tse-Yong Yao, Fred C. Redeker, Yutao Ma | 2002-08-20 |
| 6436832 | Method to reduce polish initiation time in a polish process | Yutao Ma, Juilung Li, Fred C. Redeker, Tse-Yong Yao | 2002-08-20 |