Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199400 | Array substrate, display panel and display device | Jingyi Xu, Bo Yang, Yanwei Ren, Xin Zhao, Yanyan Zhao +3 more | 2019-02-05 |
| 10163754 | Lid design for heat dissipation enhancement of die package | Kuan-Lin Ho, Sheng-Hsiang Chiu, Hsin-Yu Pan, Chin-Liang Chen | 2018-12-25 |
| 10157772 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2018-12-18 |
| 10157863 | Method for forming a lid structure for a semiconductor device package | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2018-12-18 |
| 9893043 | Method of manufacturing a chip package | Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin, Shih-Yen Lin | 2018-02-13 |
| 9887144 | Ring structure for chip packaging | Wen-Yi Lin, Ming-Chih Yew, Tsung-Shu Lin, Bor-Rung Su, Jing Ruei Lu +1 more | 2018-02-06 |
| 9859265 | Package structure and methods of forming the same | Kuan-Lin Ho, Wei-Ting Lin, Chin-Liang Chen, Jing Ruei Lu | 2018-01-02 |
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2017-11-07 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin | 2017-10-31 |
| 9793242 | Packages with die stack including exposed molding underfill | Hai-Ming Chen, Wei-Ting Lin, Jing Ruei Lu, Tsung-Ding Wang | 2017-10-17 |
| 9786520 | Semiconductor device and manufacturing method thereof | Chang-Chia Huang, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Shih-Yen Lin, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2017-06-06 |
| 9666556 | Flip chip packaging | Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin | 2017-05-30 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9502373 | Lid attach process and apparatus for fabrication of semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Jason Shen | 2016-11-22 |
| 9462507 | Load balancing method and system for multi-band network | Baiqiu Huang, Jun Feng, Chao Yao | 2016-10-04 |
| 9415501 | Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2016-08-16 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9287233 | Adhesive pattern for advance package reliability improvement | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Chun-Cheng Lin, Shih-Yen Lin | 2016-03-15 |
| 9209046 | Semiconductor device and manufacturing method thereof | Chang-Chia Huang, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2015-12-08 |
| 9191439 | Method and system for data synchronization in content delivery network | Hao Liu, Jianchun Wang | 2015-11-17 |
| 9147584 | Rotating curing | Jing Ruei Lu, Ming-Chung Sung, Wei-Ting Lin, Chien-Kuo Chang | 2015-09-29 |
| 9142523 | Semiconductor device and manufacturing method thereof | Chun-Cheng Lin, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin | 2015-09-22 |
| 8993378 | Flip-chip BGA assembly process | Jing Ruei Lu, Wei-Ting Lin, Sao-Ling Chiu, Hsin-Yu Pan | 2015-03-31 |