Issued Patents All Time
Showing 376–393 of 393 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8797057 | Testing of semiconductor chips with microbumps | Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2014-08-05 |
| 8761956 | Computer and control method for smart fan thereof | Chung-Wei Chen | 2014-06-24 |
| 8753931 | Cost-effective gate replacement process | Ming Zhu, Jyun-Ming Lin, Bao-Ru Young, Hak-Lay Chuang | 2014-06-17 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2014-06-17 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Hsien-Pin Hu, Shang-Yun Hou +2 more | 2014-04-08 |
| 8564305 | Discontinuous type layer-ID detector for 3D-IC and method of the same | Ming-Pin Chen, Meng-Fan Chang | 2013-10-22 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2013-10-15 |
| 8546227 | Contact for high-K metal gate device | Hak-Lay Chuang, Sheng-Chen Chung, Bao-Ru Young, Huan-Just Lin, Tsai-Chun Li | 2013-10-01 |
| 8329521 | Method and device with gate structure formed over the recessed top portion of the isolation structure | Harry-Hak-Lay Chuang, Bao-Ru Young, Sheng-Chen Chung, Kai-Shyang You, Jin-Aun Ng +1 more | 2012-12-11 |
| 8283781 | Semiconductor device having pad structure with stress buffer layer | Shang-Yun Hou, Shin-Puu Jeng, Tzuan-Horng Liu, Tzu-Wei Chiu, Chao-Wen Shih | 2012-10-09 |
| 8258606 | High frequency flip chip package structure of polymer substrate | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Chin-Te Wang | 2012-09-04 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Shin-Puu Jeng, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2012-06-05 |
| 8169276 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Edward Yi Chang, Ruey-Bing Hwang, Li-Han Hsu | 2012-05-01 |
| 8033039 | High frequency flip chip package process of polymer substrate and structure thereof | Edward Yi Chang, Li-Han Hsu, Chee-Way Oh, Chin-Te Wang | 2011-10-11 |
| 7969193 | Differential sensing and TSV timing control scheme for 3D-IC | Yen-Huei Chen, Meng-Fan Chang | 2011-06-28 |
| 7940143 | Vertical transmission line structure that includes bump elements for flip-chip mounting | Edward Yi Chang, Ruey-Bing Hwang, Li-Han Hsu | 2011-05-10 |
| 7898081 | MEMS device and method of making the same | Bang-Chiang Lan, Li-Hsun Ho, Hui-Min Wu, Min Chen, Chien-Hsin Huang +1 more | 2011-03-01 |
| 7724726 | Data transmission system for dynamically adjusting PDU length, method thereof, and computer-readable recording medium | Kun-Hung Lee | 2010-05-25 |