Issued Patents All Time
Showing 76–100 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355978 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-05-31 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2016-05-31 |
| 9355906 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2016-05-31 |
| 9349665 | Methods and apparatus of packaging of semiconductor devices | Hsien-Wei Chen, Jie Chen, Ying-Ju Chen | 2016-05-24 |
| 9337117 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Shih-Wei Liang | 2016-05-10 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Yen-Ping Wang, Hao-Yi Tsai, Shih-Wei Liang | 2016-05-10 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih +1 more | 2016-04-05 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9275925 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-03-01 |
| 9269658 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng | 2016-02-23 |
| 9269682 | Method of forming bump structure | Hsien-Wei Chen, Ying-Ju Chen | 2016-02-23 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Hsien-Wei Chen, Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen | 2016-01-26 |
| 9136318 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2015-09-15 |
| 9129816 | Contact test structure and method | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2015-09-08 |
| 9117831 | Seal ring structure for integrated circuit chips | Ching-Jung Yang, Yu-Wen Liu, Michael Shou-Ming Tong, Hsien-Wei Chen, Chung-Ying Yang | 2015-08-25 |
| 9099485 | Methods and apparatus of guard rings for wafer-level-packaging | Hsien-Wei Chen | 2015-08-04 |
| 9013038 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2015-04-21 |
| 9006891 | Method of making a semiconductor device having a post-passivation interconnect structure | Shih-Wei Liang, Hsien-Wei Chen, Ying-Ju Chen, Mirng-Ji Lii | 2015-04-14 |
| 9000876 | Inductor for post passivation interconnect | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen | 2015-04-07 |
| 8994181 | Bond pad structure to reduce bond pad corrosion | Ying-Ju Chen, Hsien-Wei Chen, Shih-Wei Liang | 2015-03-31 |
| 8987922 | Methods and apparatus for wafer level packaging | Hsien-Wei Chen, Wen-Hsiung Lu, Hung-Jen Lin | 2015-03-24 |
| 8957503 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Shih-Wei Liang | 2015-02-17 |
| 8916465 | UBM structures for wafer level chip scale packaging | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2014-12-23 |
| 8884400 | Capacitor in Post-Passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen +1 more | 2014-11-11 |