Issued Patents All Time
Showing 26–50 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139249 | Semiconductor devices and methods of forming the same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh | 2021-10-05 |
| 11043463 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2021-06-22 |
| 10991649 | Semiconductor device and method of manufacturing semiconductor device | Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2021-04-27 |
| 10964659 | Semiconductor device | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen | 2021-03-30 |
| 10811369 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2020-10-20 |
| 10720495 | Semiconductor device and manufacturing method thereof | Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo, Chia-Chun Miao | 2020-07-21 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10522480 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2019-12-31 |
| 10510652 | Method of manufacturing semiconductor device | Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2019-12-17 |
| 10475760 | Semiconductor device | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen | 2019-11-12 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2019-06-04 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2019-04-16 |
| 10079213 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2018-09-18 |
| 10043770 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2018-08-07 |
| 10037962 | Ball height control in bonding process | Hsien-Wei Chen, Jie Chen | 2018-07-31 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng | 2018-06-12 |
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Hsien-Wei Chen, Ying-Ju Chen, Yu-Feng Chen, Tsung-Ding Wang | 2018-06-12 |
| 9984965 | Inductor system and method | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2018-05-29 |
| 9978704 | Semiconductor devices with ball strength improvement | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2018-05-22 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9831196 | Methods and apparatus of guard rings for wafer-level-packaging | Hsien-Wei Chen | 2017-11-28 |
| 9831205 | Semiconductor device and manufacturing method thereof | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen | 2017-11-28 |
| 9812392 | Inductor system and method | Hsien-Wei Chen, Hung-Yi Kuo, Hao-Yi Tsai | 2017-11-07 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Ying-Ju Chen, Yu-Feng Chen, Tsung-Ding Wang | 2017-10-31 |