Issued Patents All Time
Showing 101–106 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8871629 | Methods of and semiconductor devices with ball strength improvement | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2014-10-28 |
| 8692378 | UBM structures for wafer level chip scale packaging | Hsien-Wei Chen, Ying-Ju Chen, Shih-Wei Liang | 2014-04-08 |
| 8624359 | Wafer level chip scale package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Shih-Wei Liang | 2014-01-07 |
| 8581389 | Uniformity control for IC passivation structure | Hsien-Wei Chen | 2013-11-12 |
| 8581400 | Post-passivation interconnect structure | Shih-Wei Liang, Hsien-Wei Chen, Ying-Ju Chen, Mirng-Ji Lii | 2013-11-12 |
| 8217499 | Structure to reduce etching residue | Hsien-Wei Chen, Chung-Ying Yang | 2012-07-10 |