Issued Patents All Time
Showing 201–225 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9112001 | Package systems and manufacturing methods thereof | Chia-Pao Shu, Kuei-Sung Chang, Hsin-Ting Huang, Shang-Ying Tsai, Jung-Huei Peng | 2015-08-18 |
| 9096420 | Methods and apparatus for MEMS devices with increased sensitivity | Chia-Hua Chu | 2015-08-04 |
| 9085455 | MEMS devices and methods for forming same | Chia-Hua Chu | 2015-07-21 |
| 9080969 | Backside CMOS compatible BioFET with no plasma induced damage | Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai | 2015-07-14 |
| 9079761 | Stacked semiconductor device and method of forming the same related cases | Chia-Hua Chu | 2015-07-14 |
| 9056766 | Method of forming a bond ring for a first and second substrate | Hsueh-An Yang | 2015-06-16 |
| 9054121 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng +2 more | 2015-06-09 |
| 9040334 | MEMS integrated pressure sensor devices and methods of forming same | Chia-Hua Chu | 2015-05-26 |
| 9035451 | Wafer level sealing methods with different vacuum levels for MEMS sensors | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang | 2015-05-19 |
| 9006015 | Dual layer microelectromechanical systems device and method of manufacturing same | Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Kai-Chih Liang, Chung-Hsien Lin | 2015-04-14 |
| 9000578 | Package systems having an opening in a substrate thereof and manufacturing methods thereof | Chia-Pao Shu, Kuei-Sung Chang | 2015-04-07 |
| 8962367 | MEMS device with release aperture | Chung-Hsien Lin, Chia-Hua Chu | 2015-02-24 |
| 8952465 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | Kai-Chih Liang | 2015-02-10 |
| 8951716 | Surface modification, functionalization and integration of microfluidics and biosensor to form a biochip | Yi-Shao Liu, Chun-Ren Cheng | 2015-02-10 |
| 8941152 | Semiconductor device | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2015-01-27 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2014-12-09 |
| 8900905 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng, Kuei-Sung Chang | 2014-12-02 |
| 8895360 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Alex Kalnitsky, Chia-Hua Chu | 2014-11-25 |
| 8846416 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Chia-Hua Chu, Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu +1 more | 2014-09-30 |
| 8810027 | Bond ring for a first and second substrate | Hsueh-An Yang | 2014-08-19 |
| 8802473 | MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same | Chia-Hua Chu | 2014-08-12 |
| 8797127 | MEMS switch with reduced dielectric charging effect | Chia-Hua Chu, Chung-Hsien Lin | 2014-08-05 |
| 8790946 | Methods of bonding caps for MEMS devices | Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Lan-Lin Chao +1 more | 2014-07-29 |
| 8728844 | Backside CMOS compatible bioFET with no plasma induced damage | Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai | 2014-05-20 |
| 8729646 | MEMS devices and methods for forming the same | Chia-Hua Chu, Te-Hao Lee, Chung-Hsien Lin | 2014-05-20 |