Issued Patents All Time
Showing 176–200 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9352956 | MEMS devices and methods for forming same | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2016-05-31 |
| 9337182 | Method to integrate different function devices fabricated by different process technologies | Kuei-Sung Chang, Alex Kalnitsky, Chia-Hua Chu | 2016-05-10 |
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin +2 more | 2016-05-10 |
| 9316704 | Magnetic sensor and forming method | Kuei-Sung Chang | 2016-04-19 |
| 9315378 | Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding | Hung-Chia Tsai | 2016-04-19 |
| 9309109 | MEMS-CMOS integrated devices, and methods of integration at wafer level | Chia-Hua Chu | 2016-04-12 |
| 9310332 | Semiconductor device and selective heating thereof | Tung-Tsun Chen, Jui-Cheng Huang, Chin-Hua Wen, Yi-Shao Liu | 2016-04-12 |
| 9290376 | MEMS packaging techniques | Chien-Hsuan Tai, Chia-Hua Chu | 2016-03-22 |
| 9293431 | Integrated semiconductor device and wafer level method of fabricating the same | Kuei-Sung Chang, Alexander Kalnitsky, Chia-Hua Chu | 2016-03-22 |
| 9293445 | Wafer level packaging bond | Ping-Yin Liu, Li-Chen CHU, Hung-Hua Lin, H. T. Huang, Jung-Huei Peng +3 more | 2016-03-22 |
| 9260295 | MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same | Chia-Hua Chu | 2016-02-16 |
| 9260296 | MEMS integrated pressure sensor devices and methods of forming same | Chia-Hua Chu | 2016-02-16 |
| 9264833 | Structure and method for integrated microphone | Jung-Huei Peng, Chia-Hua Chu, Yao-Te Huang, Chin-Yi Cho, Li-Min Hung | 2016-02-16 |
| 9254997 | CMOS-MEMS integrated flow for making a pressure sensitive transducer | Kai-Chih Liang, Chia-Hua Chu | 2016-02-09 |
| 9254998 | MEMS device with a capping substrate | Chia-Huan Chu | 2016-02-09 |
| 9254487 | Systems and methods for an integrated bio-entity manipulation and processing semiconductor device | Yi-Hsien Chang, Chun-Ren Cheng, Alex Kalnitsky | 2016-02-09 |
| 9238578 | Semiconductor arrangement with stress release and thermal insulation | Chia-Hua Chu, Yi-Chuan Teng | 2016-01-19 |
| 9233839 | MEMS device and method of forming the same | Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng, Kuei-Sung Chang | 2016-01-12 |
| 9221674 | Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop | Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang | 2015-12-29 |
| 9187317 | MEMS integrated pressure sensor and microphone devices and methods of forming same | Chia-Hua Chu | 2015-11-17 |
| 9150404 | Semiconductor device with through molding vias | Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng | 2015-10-06 |
| 9130531 | Semiconductor arrangement with thermal insulation configuration | Chia-Hua Chu, Yi-Chuan Teng | 2015-09-08 |
| 9121820 | Top-down fabrication method for forming a nanowire transistor device | Yi-Shao Liu, Fei-Lung Lai | 2015-09-01 |
| 9123547 | Stacked semiconductor device and method of forming the same | Chia-Hua Chu | 2015-09-01 |
| 9114976 | Semiconductor arrangement with stress release configuration | Chia-Hua Chu, Yi-Chuan Teng | 2015-08-25 |