Issued Patents All Time
Showing 26–50 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2014-06-24 |
| 8723305 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2014-05-13 |
| 8648448 | Semiconductor device and method of shielding semiconductor die from inter-device interference | Reza A. Pagaila, Byung Tai Do, Heap Hoe Kuan | 2014-02-11 |
| 8642382 | Integrated circuit packaging system with support structure and method of manufacture thereof | Heap Hoe Kuan, Reza A. Pagaila | 2014-02-04 |
| 8624364 | Integrated circuit packaging system with encapsulation connector and method of manufacture thereof | Seng Guan Chow, Hin Hwa Goh, Heap Hoe Kuan | 2014-01-07 |
| 8614508 | Integrated circuit system with test pads and method of manufacture thereof | Bao Xusheng | 2013-12-24 |
| 8558277 | Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices | Robert C. Frye, Yaojian Lin | 2013-10-15 |
| 8546195 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2013-10-01 |
| 8507319 | Integrated circuit package system with shield | Seng Guan Chow, Byung Tai Do, Heap Hoe Kuan | 2013-08-13 |
| 8492204 | Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2013-07-23 |
| 8487434 | Integrated circuit package system with redistribution layer and method for manufacturing thereof | Heap Hoe Kuan, Seng Guan Chow | 2013-07-16 |
| 8476120 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2013-07-02 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2013-06-04 |
| 8455991 | Integrated circuit packaging system with warpage control and method of manufacture thereof | Yung Kuan Hsiao, Xusheng Bao, Kang Chen, Hin Hwa Goh | 2013-06-04 |
| 8436439 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Reza A. Pagaila, Yaojian Lin | 2013-05-07 |
| 8421212 | Integrated circuit packaging system with active surface heat removal and method of manufacture thereof | Kang Chen, Xusheng Bao, Yung Kuan Hsiao, Hin Hwa Goh | 2013-04-16 |
| 8409921 | Integrated circuit package system including honeycomb molding | Heap Hoe Kuan, Hamid Eslampour, DaeSik Choi, Taeg Ki Lim | 2013-04-02 |
| 8404518 | Integrated circuit packaging system with package stacking and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila | 2013-03-26 |
| 8405228 | Integrated circuit packaging system with package underfill and method of manufacture thereof | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2013-03-26 |
| 8399305 | Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist | Seng Guan Chow, Heap Hoe Kuang | 2013-03-19 |
| 8390108 | Integrated circuit packaging system with stacking interconnect and method of manufacture thereof | NamJu Cho, HeeJo Chi, HanGil Shin, Seng Guan Chow, Heap Hoe Kuan | 2013-03-05 |
| 8368188 | Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof | Byung Tai Do, Heap Hoe Kuan | 2013-02-05 |
| 8368199 | Integrated circuit package system for stackable devices and method for manufacturing thereof | Seng Guan Chow, Heap Hoe Kuan | 2013-02-05 |
| 8354746 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan | 2013-01-15 |
| 8354304 | Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant | Seng Guan Chow, Il Kwon Shim, Heap Hoe Kuan | 2013-01-15 |