Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863109 | Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2011-01-04 |
| 7859094 | Integrated circuit package system for stackable devices | Seng Guan Chow, Heap Hoe Kuan | 2010-12-28 |
| 7843047 | Encapsulant interposer system with integrated passive devices and manufacturing method therefor | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2010-11-30 |
| 7834430 | Drop-mold conformable material as an encapsulation for an integrated circuit package system | Byung Tai Do, Heap Hoe Kuan | 2010-11-16 |
| 7812449 | Integrated circuit package system with redistribution layer | Heap Hoe Kuan, Seng Guan Chow | 2010-10-12 |
| 7799602 | Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure | Reza A. Pagaila, Yaojian Lin | 2010-09-21 |
| 7772080 | Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices | Robert C. Frye, Yaojian Lin | 2010-08-10 |
| 7772046 | Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference | Reza A. Pagaila, Byung Tai Do, Yaojian Lin | 2010-08-10 |
| 7732252 | Multi-chip package system incorporating an internal stacking module with support protrusions | Seng Guan Chow, Heap Hoe Kuan | 2010-06-08 |
| 7701040 | Semiconductor package and method of reducing electromagnetic interference between devices | Yaojian Lin, Seng Guan Chow | 2010-04-20 |
| 7666709 | Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns | Yaojian Lin, Hin Hwa Goh | 2010-02-23 |
| 7618846 | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device | Reza A. Pagaila, Byung Tai Do | 2009-11-17 |
| 7615910 | High frequency surface acoustic wave device | Wen-Ching Shih | 2009-11-10 |
| 7576414 | Electrostatic discharge (ESD) protection structure | Yaojian Lin, Seng Guan Chow | 2009-08-18 |
| 7449377 | Method of fabricating poly silicon layer | Chiung-Wei Lin, Sheng-Chi Lee, Yi-Liang Chen, Te-Hua Teng | 2008-11-11 |