Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8304880 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Seng Guan Chow, Hin Hwa Goh, Heap Hoe Kuan | 2012-11-06 |
| 8299596 | Integrated circuit packaging system with bump conductors and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2012-10-30 |
| 8288844 | Integrated circuit packaging system with package stacking and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2012-10-16 |
| 8269320 | Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan | 2012-09-18 |
| 8258612 | Encapsulant interposer system with integrated passive devices and manufacturing method therefor | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2012-09-04 |
| 8178956 | Integrated circuit package system for shielding electromagnetic interference | Byung Tai Do, Heap Hoe Kuan | 2012-05-15 |
| 8163597 | Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2012-04-24 |
| 8159047 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2012-04-17 |
| 8138590 | Integrated circuit package system with wire-in-film encapsulation | Seng Guan Chow, Heap Hoe Kuan | 2012-03-20 |
| 8138024 | Package system for shielding semiconductor dies from electromagnetic interference | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan | 2012-03-20 |
| 8134227 | Stacked integrated circuit package system with conductive spacer | Lionel Chien Hui Tay, Seng Guan Chow | 2012-03-13 |
| 8101460 | Semiconductor device and method of shielding semiconductor die from inter-device interference | Reza A. Pagaila, Byung Tai Do, Heap Hoe Kuan | 2012-01-24 |
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2011-12-27 |
| 8080885 | Integrated circuit packaging system with multi level contact and method of manufacture thereof | Seng Guan Chow, Heap Hoe Kuan | 2011-12-20 |
| 8076757 | Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference | Reza A. Pagaila, Byung Tai Do, Yaojian Lin | 2011-12-13 |
| 8072059 | Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die | Il Kwon Shim, Seng Guan Chow, Yaojian Lin | 2011-12-06 |
| 8049314 | Integrated circuit package system with insulator over circuitry | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2011-11-01 |
| 8048776 | Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps | Byung Tai Do, Heap Hoe Kuan, Yaojian Lin | 2011-11-01 |
| 8039311 | Leadless semiconductor chip carrier system | Heap Hoe Kuan, Seng Guan Chow | 2011-10-18 |
| 7993941 | Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan | 2011-08-09 |
| 7989269 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2011-08-02 |
| 7989270 | Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors | Heap Hoe Kuan, Yaojian Lin, Seng Guan Chow | 2011-08-02 |
| 7923846 | Integrated circuit package-in-package system with wire-in-film encapsulant | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua | 2011-04-12 |
| 7902644 | Integrated circuit package system for electromagnetic isolation | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan | 2011-03-08 |
| 7880275 | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device | Reza A. Pagaila, Byung Tai Do | 2011-02-01 |