Issued Patents All Time
Showing 51–75 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7033929 | Dual damascene interconnect structure with improved electro migration lifetimes | William K. Barth, Hongqiang Lu | 2006-04-25 |
| 6987059 | Method and structure for creating ultra low resistance damascene copper wiring | Hongqiang Lu, Sey-Shing Sun | 2006-01-17 |
| 6969651 | Layout design and process to form nanotube cell for nanotube memory applications | Hongqiang Lu, William K. Barth | 2005-11-29 |
| 6964924 | Integrated circuit process monitoring and metrology system | Eric Jacob Jan Kirchner, James R. B. Elmer | 2005-11-15 |
| 6955937 | Carbon nanotube memory cell for integrated circuit structure with removable side spacers to permit access to memory cell and process for forming such memory cell | Sey-Shing Sun, Hong-Qiang Lu | 2005-10-18 |
| 6939800 | Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures | Hong-Qiang Lu, Wilbur G. Catabay | 2005-09-06 |
| 6905909 | Ultra low dielectric constant thin film | Hao Cui, Wilbur G. Catabay | 2005-06-14 |
| 6860802 | Polishing pads for chemical mechanical planarization | Arun Vishwanathan, David B. James, Lee Melbourne Cook, David Shidner | 2005-03-01 |
| 6749485 | Hydrolytically stable grooved polishing pads for chemical mechanical planarization | David B. James, Arun Vishwanathan, Lee Melbourne Cook, David Shidner, Joseph So +1 more | 2004-06-15 |
| 6736709 | Grooved polishing pads for chemical mechanical planarization | David B. James, Arun Vishwanathan, Lee Melbourne Cook, David Shidner, Joseph So +1 more | 2004-05-18 |
| 6699299 | Composition and method for polishing in metal CMP | Vikas Sachan, Elizabeth A. (Kegerise) Langlois, Qianqiu (Christine) Ye, Keith G. Pierce, Craig Lack +3 more | 2004-03-02 |
| 6693035 | Methods to control film removal rates for improved polishing in metal CMP | Vikas Sachan, Elizabeth A. (Kegerise) Langlois, Keith G. Pierce | 2004-02-17 |
| 6648743 | Chemical mechanical polishing pad | — | 2003-11-18 |
| 6642597 | Inter-layer interconnection structure for large electrical connections | William K. Barth | 2003-11-04 |
| 6616717 | Composition and method for polishing in metal CMP | Vikas Sachan, Elizabeth A. (Kegerise) Langlois, Qianqiu (Christine) Ye, Keith G. Pierce, Craig Lack +3 more | 2003-09-09 |
| 6602112 | Dissolution of metal particles produced by polishing | Tony Quan Tran, Vikas Sachan, David Gettman, Terence M. Thomas, Craig Lack | 2003-08-05 |
| 6582283 | Polishing pads for chemical mechanical planarization | David B. James, Arun Vishwanathan, Lee Melbourne Cook, David Shidner | 2003-06-24 |
| 6475069 | Control of removal rates in CMP | Terence M. Thomas, Qianqiu (Christine) Ye, Joseph So | 2002-11-05 |
| 6454634 | Polishing pads for chemical mechanical planarization | David B. James, Arun Vishwanathan, Lee Melbourne Cook, David Shidner | 2002-09-24 |
| 6447373 | Chemical mechanical polishing slurries for metal | Craig Lack, Qiuliang Luo, Qianqiu (Christine) Ye, Vikas Sachan, Terence M. Thomas | 2002-09-10 |
| 6419553 | Methods for break-in and conditioning a fixed abrasive polishing pad | Vilas Koinkar, Reza Golzarian, Matthew VanHanehem, Qiuliang Luo, James Shen | 2002-07-16 |
| 6325705 | Chemical-mechanical polishing slurry that reduces wafer defects and polishing system | Peter J. Beckage | 2001-12-04 |
| 6168640 | Chemical-mechanical polishing slurry that reduces wafer defects | Peter J. Beckage | 2001-01-02 |
| 6110294 | Apparatus and method for cleaning semiconductor wafer | Kevin Shipley | 2000-08-29 |
| 6106661 | Polishing pad having a wear level indicator and system using the same | Christopher H. Raeder, Kevin Shipley | 2000-08-22 |