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Silicon deposition over dual surface orientation substrates to promote uniform polishing |
Gregory S. Spencer, Mariam Sadaka |
2010-07-13 |
| 7670895 |
Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layer |
Toni D. Van Gompel, Mohamad Jahanbani, Michael D. Turner |
2010-03-02 |
| 7378306 |
Selective silicon deposition for planarized dual surface orientation integration |
Gregory S. Spencer, Mariam Sadaka, Veer Dhandapani |
2008-05-27 |
| 6809032 |
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques |
Frank Mauersberger, Paul R. Besser, Frederick N. Hause, Errol Todd Ryan, William S. Brennan +1 more |
2004-10-26 |
| 6666754 |
Method and apparatus for determining CMP pad conditioner effectiveness |
— |
2003-12-23 |
| 6572443 |
Method and apparatus for detecting a process endpoint |
Keith A. Edwards, Ralf B. Lukner, Wonhui Cho |
2003-06-03 |
| 6555479 |
Method for forming openings for conductive interconnects |
Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more |
2003-04-29 |
| 6514858 |
Test structure for providing depth of polish feedback |
Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more |
2003-02-04 |
| 6489240 |
Method for forming copper interconnects |
John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan +1 more |
2002-12-03 |
| 6413846 |
Contact each methodology and integration scheme |
Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, William S. Brennan +1 more |
2002-07-02 |
| 6368184 |
Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes |
— |
2002-04-09 |
| 6325705 |
Chemical-mechanical polishing slurry that reduces wafer defects and polishing system |
Peter A. Burke |
2001-12-04 |
| 6179688 |
Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation |
Keith A. Edwards, Ralf B. Lukner, Wonhui Cho |
2001-01-30 |
| 6168640 |
Chemical-mechanical polishing slurry that reduces wafer defects |
Peter A. Burke |
2001-01-02 |
| 6051495 |
Seasoning of a semiconductor wafer polishing pad to polish tungsten |
Peter A. Burke, Kevin Shipley |
2000-04-18 |
| 5934978 |
Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects |
Peter A. Burke |
1999-08-10 |