Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7754587 | Silicon deposition over dual surface orientation substrates to promote uniform polishing | Gregory S. Spencer, Mariam Sadaka | 2010-07-13 |
| 7670895 | Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layer | Toni D. Van Gompel, Mohamad Jahanbani, Michael D. Turner | 2010-03-02 |
| 7378306 | Selective silicon deposition for planarized dual surface orientation integration | Gregory S. Spencer, Mariam Sadaka, Veer Dhandapani | 2008-05-27 |
| 6809032 | Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques | Frank Mauersberger, Paul R. Besser, Frederick N. Hause, Errol Todd Ryan, William S. Brennan +1 more | 2004-10-26 |
| 6666754 | Method and apparatus for determining CMP pad conditioner effectiveness | — | 2003-12-23 |
| 6572443 | Method and apparatus for detecting a process endpoint | Keith A. Edwards, Ralf B. Lukner, Wonhui Cho | 2003-06-03 |
| 6555479 | Method for forming openings for conductive interconnects | Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more | 2003-04-29 |
| 6514858 | Test structure for providing depth of polish feedback | Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more | 2003-02-04 |
| 6489240 | Method for forming copper interconnects | John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan +1 more | 2002-12-03 |
| 6413846 | Contact each methodology and integration scheme | Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, William S. Brennan +1 more | 2002-07-02 |
| 6368184 | Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes | — | 2002-04-09 |
| 6325705 | Chemical-mechanical polishing slurry that reduces wafer defects and polishing system | Peter A. Burke | 2001-12-04 |
| 6179688 | Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation | Keith A. Edwards, Ralf B. Lukner, Wonhui Cho | 2001-01-30 |
| 6168640 | Chemical-mechanical polishing slurry that reduces wafer defects | Peter A. Burke | 2001-01-02 |
| 6051495 | Seasoning of a semiconductor wafer polishing pad to polish tungsten | Peter A. Burke, Kevin Shipley | 2000-04-18 |
| 5934978 | Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects | Peter A. Burke | 1999-08-10 |