Peter J. Beckage — 16 Patents at AMD

Peter J. Beckage has been granted 16 US patents while listed as an inventor at AMD. The first was granted in 1999 and the most recent in July 2010. Peter J. Beckage ranks #284,196 of 4,157,543 US inventors in our database (top 6.8%). Patent records list Peter J. Beckage in Austin, TX, US.

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Showing 1–16 of 16 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7754587	Silicon deposition over dual surface orientation substrates to promote uniform polishing	Gregory S. Spencer, Mariam Sadaka	2010-07-13
7670895	Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layer	Toni D. Van Gompel, Mohamad Jahanbani, Michael D. Turner	2010-03-02
7378306	Selective silicon deposition for planarized dual surface orientation integration	Gregory S. Spencer, Mariam Sadaka, Veer Dhandapani	2008-05-27
6809032	Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques	Frank Mauersberger, Paul R. Besser, Frederick N. Hause, Errol Todd Ryan, William S. Brennan +1 more	2004-10-26	$3,793,000
6666754	Method and apparatus for determining CMP pad conditioner effectiveness	—	2003-12-23	$5,236,000
6572443	Method and apparatus for detecting a process endpoint	Keith A. Edwards, Ralf B. Lukner, Wonhui Cho	2003-06-03	$3,251,000
6555479	Method for forming openings for conductive interconnects	Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more	2003-04-29	$1,822,000
6514858	Test structure for providing depth of polish feedback	Frederick N. Hause, Paul R. Besser, Frank Mauersberger, Errol Todd Ryan, William S. Brennan +1 more	2003-02-04	$1,030,000
6489240	Method for forming copper interconnects	John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Frank Mauersberger, Errol Todd Ryan +1 more	2002-12-03	$4,258,000
6413846	Contact each methodology and integration scheme	Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, Frank Mauersberger, William S. Brennan +1 more	2002-07-02	$3,406,000
6368184	Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes	—	2002-04-09	$2,418,000
6325705	Chemical-mechanical polishing slurry that reduces wafer defects and polishing system	Peter A. Burke	2001-12-04	$4,361,000
6179688	Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation	Keith A. Edwards, Ralf B. Lukner, Wonhui Cho	2001-01-30	$6,431,000
6168640	Chemical-mechanical polishing slurry that reduces wafer defects	Peter A. Burke	2001-01-02	$6,157,000
6051495	Seasoning of a semiconductor wafer polishing pad to polish tungsten	Peter A. Burke, Kevin Shipley	2000-04-18	$8,077,000
5934978	Methods of making and using a chemical-mechanical polishing slurry that reduces wafer defects	Peter A. Burke	1999-08-10	$2,113,000

Peter J. Beckage — 16 Patents

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