MS

Mariam Sadaka

SO Soitec: 35 patents #5 of 259Top 2%
FS Freeescale Semiconductor: 35 patents #38 of 3,767Top 2%
FU Flextronics International Usa: 4 patents #6 of 45Top 15%
Motorola: 3 patents #3,303 of 12,470Top 30%
Apple: 1 patents #12,251 of 18,612Top 70%
SO Sony: 1 patents #17,262 of 25,231Top 70%
CEA: 1 patents #3,381 of 7,956Top 45%
ST S.O.I. Tec Silicon On Insulator Technologies: 1 patents #92 of 155Top 60%
TSMC: 1 patents #8,466 of 12,232Top 70%
🗺 Texas: #670 of 125,132 inventorsTop 1%
Overall (All Time): #21,555 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 1–25 of 82 patents

Patent #TitleCo-InventorsDate
12344524 Methods of fabricating semiconductor structures including cavities filled with a sacrificial material Ludovic Ecarnot 2025-07-01
11876348 Trench process for dense VCSEL design Date Jan Willem Noorlag 2024-01-16
10703627 Methods of fabricating semiconductor structures including cavities filled with a sacrificial material Ludovic Ecarnot 2020-07-07
10553562 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods 2020-02-04
9818874 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Christophe Maleville 2017-11-14
9728458 Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures Bernard Aspar, Chrystelle Lagahe Blanchard 2017-08-08
9716164 Methods of forming III-V semiconductor structures using multiple substrates, and semiconductor devices fabricated using such methods 2017-07-25
9553014 Bonded processed semiconductor structures and carriers Ionut Radu 2017-01-24
9511996 Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices Bernard Aspar, Chrystelle Lagahe Blanchard 2016-12-06
9481566 Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices Bernard Aspar, Chrystelle Lagahe Blanchard 2016-11-01
9391011 Semiconductor structures including fluidic microchannels for cooling and related methods 2016-07-12
9349865 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Christophe Maleville 2016-05-24
9293448 Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates Bich-Yen Nguyen 2016-03-22
9245836 Interposers including fluidic microchannels and related structures and methods 2016-01-26
9219150 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Christophe Maleville 2015-12-22
9165945 Method for fabricating semiconductor structures including transistor channels having different strain states, and related semiconductor structures Bich-Yen Nguyen, Ionut Radu 2015-10-20
9136134 Methods of providing thin layers of crystalline semiconductor material, and related structures and devices Ionut Radu 2015-09-15
9041214 Bonded processed semiconductor structures and carriers Ionut Radu 2015-05-26
9034727 Methods and structures for forming integrated semiconductor structures Radu Ionut 2015-05-19
8987114 Bonded semiconductor structures and method of forming same Carlos Mazure, Bich-Yen Nguyen 2015-03-24
8980688 Semiconductor structures including fluidic microchannels for cooling and related methods 2015-03-17
8970045 Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devices 2015-03-03
8890299 Bonded semiconductor structures and methods of forming same Radu Ionut 2014-11-18
8866305 Methods of forming bonded semiconductor structures Ionut Radu 2014-10-21
8841742 Low temperature layer transfer process using donor structure with material in recesses in transfer layer, semiconductor structures fabricated using such methods Ionut Radu 2014-09-23