Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418120 | Structure for radio frequency applications | Eric Desbonnets | 2025-09-16 |
| 12101080 | Heterostructure and method of fabrication | Arnaud Castex, Daniel Delprat, Ionut Radu | 2024-09-24 |
| 11637542 | Heterostructure and method of fabrication | Arnaud Castex, Daniel Delprat, Ionut Radu | 2023-04-25 |
| 11595020 | Heterostructure and method of fabrication | Arnaud Castex, Daniel Delprat, Ionut Radu | 2023-02-28 |
| 11502428 | Structure for radio frequency applications | Eric Desbonnets | 2022-11-15 |
| 11043756 | Structure for radio frequency applications | Eric Desbonnets | 2021-06-22 |
| 10826459 | Heterostructure and method of fabrication | Arnaud Castex, Daniel Delprat, Ionut Radu | 2020-11-03 |
| 9728458 | Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures | Mariam Sadaka, Chrystelle Lagahe Blanchard | 2017-08-08 |
| 9511996 | Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices | Mariam Sadaka, Chrystelle Lagahe Blanchard | 2016-12-06 |
| 9481566 | Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices | Mariam Sadaka, Chrystelle Lagahe Blanchard | 2016-11-01 |
| 8722515 | Process of treating defects during the bonding of wafers | Chrystelle Lagahe | 2014-05-13 |
| 8679946 | Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate | Hubert Moriceau, Eric Jalaguier, Fabrice Letertre | 2014-03-25 |
| 8628674 | Method for trimming a structure obtained by the assembly of two plates | Marc Zussy, Chrystelle Lagahe-Blanchard, Hubert Moriceau | 2014-01-14 |
| 8609514 | Process for the transfer of a thin film comprising an inclusion creation step | Hubert Moriceau, Michel Bruel, Christophe Maleville | 2013-12-17 |
| 8575010 | Method for fabricating a semiconductor substrate | Alexis Drouin, Christophe Desrumaux, Olivier Ledoux, Christophe Figuet | 2013-11-05 |
| 8530334 | Process of treating defects during the bonding of wafers | Chrystelle Lagahe | 2013-09-10 |
| 8481409 | Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate | Hubert Moriceau, Eric Jalaguier, Fabrice Letertre | 2013-07-09 |
| 8475693 | Methods of making substrate structures having a weakened intermediate layer | Michel Bruel, Chrystelle Lagahe-Blanchard | 2013-07-02 |
| 8470712 | Process for the transfer of a thin film comprising an inclusion creation step | Hubert Moriceau, Michel Bruel, Christophe Maleville | 2013-06-25 |
| 8329048 | Method for trimming a structure obtained by the assembly of two plates | Marc Zussy, Chrystelle Lagahe-Blanchard, Hubert Moriceau | 2012-12-11 |
| 8298915 | Method of transferring a circuit onto a ground plane | — | 2012-10-30 |
| 8268703 | Surface roughening process | Chrystelle Lagahe Blanchard, Nicolas Sousbie | 2012-09-18 |
| 8232130 | Process for assembling wafers by means of molecular adhesion | Marcel Broekaart, Thierry Barge, Chrystelle Lagahe Blanchard | 2012-07-31 |
| 8193069 | Stacked structure and production method thereof | Hubert Moriceau, Jacques Margail | 2012-06-05 |
| 8158487 | Annealing process for annealing a structure | Nicolas Sousbie, Thierry Barge, Chrystelle Lagahe Blanchard | 2012-04-17 |