Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8628674 | Method for trimming a structure obtained by the assembly of two plates | Marc Zussy, Bernard Aspar, Hubert Moriceau | 2014-01-14 |
| 8475693 | Methods of making substrate structures having a weakened intermediate layer | Michel Bruel, Bernard Aspar | 2013-07-02 |
| 8329048 | Method for trimming a structure obtained by the assembly of two plates | Marc Zussy, Bernard Aspar, Hubert Moriceau | 2012-12-11 |
| 8044465 | Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate | Bernard Aspar | 2011-10-25 |
| 7927980 | Method for forming a detachable substrate including implantation and exfoliation | Aurelie Tauzin | 2011-04-19 |
| 7807482 | Method for transferring wafers | Bernard Aspar | 2010-10-05 |
| 7709305 | Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate | Bernard Aspar | 2010-05-04 |
| 7406994 | Substrate layer cutting device and method | Muriel Martinez, Thierry Barge, Alain Soubie, Cecile Berne, Olivier Rayssac | 2008-08-05 |
| 7189304 | Substrate layer cutting device and method | Muriel Martinez, Thierry Barge, Alain Soubie, Cecile Berne, Olivier Rayssac | 2007-03-13 |