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Thierry Barge — 26 Patents

SOSoitec: 13 patents #26 of 259Top 15%

STS.O.I. Tec Silicon On Insulator Technologies: 11 patents #16 of 155Top 15%

CEA: 2 patents #2,014 of 7,956Top 30%

SCShin-Etsu Handotai Co.: 2 patents #282 of 679Top 45%

Bernin, FR: #1 of 60 inventorsTop 2%

Overall (All Time): #150,017 of 4,157,543Top 4%

26 Patents All Time

Thierry Barge has been granted 26 US patents while listed as an inventor at Soitec. The first was granted in 2002 and the most recent in April 2025. Thierry Barge ranks #150,017 of 4,157,543 US inventors in our database (top 3.6%). Patent records list Thierry Barge in Bernin, FR.

Patents per Year

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #	Title	Co-Inventors	Date
12278608	Method for manufacturing a substrate for a radiofrequency device	Djamel Belhachemi	2025-04-15
12272540	Method for manufacturing a substrate	Pascal Guenard, Marcel Broekaart	2025-04-08
12167694	Method for transferring a piezoelectric layer onto a support substrate	Djamel Belhachemi	2024-12-10
12143093	Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device	Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk	2024-11-12
11979132	Method for manufacturing a substrate for a radiofrequency filter	Djamel Belhachemi	2024-05-07
11870411	Method for manufacturing a substrate for a radiofrequency device	Djamel Belhachemi	2024-01-09
11837463	Method for manufacturing a substrate	Pascal Guenard, Marcel Broekaart	2023-12-05
11711065	Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device	Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk	2023-07-25
10943778	Method for manufacturing a substrate	Pascal Guenard, Marcel Broekaart	2021-03-09
10924081	Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device	Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk	2021-02-16
10608610	Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device	Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk	2020-03-31
9812371	Methods for reducing metal contamination on a surface of a sapphire substrate by plasma treatment	—	2017-11-07
8232130	Process for assembling wafers by means of molecular adhesion	Marcel Broekaart, Bernard Aspar, Chrystelle Lagahe Blanchard	2012-07-31
8158487	Annealing process for annealing a structure	Nicolas Sousbie, Bernard Aspar, Chrystelle Lagahe Blanchard	2012-04-17
7648888	Apparatus and method for splitting substrates	Walter Schwarzenbach, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen	2010-01-19
7406994	Substrate layer cutting device and method	Muriel Martinez, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne, Olivier Rayssac	2008-08-05
7288418	Process for treating substrates for the microelectronics industry, and substrates obtained by this process	André Auberton-Herve, Hiroji Aga, Naoto Tate	2007-10-30
7235427	Method for treating substrates for microelectronics and substrates obtained by said method	Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata, Kiyoshi Mitani	2007-06-26
7189304	Substrate layer cutting device and method	Muriel Martinez, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne, Olivier Rayssac	2007-03-13
7029993	Method for treating substrates for microelectronics and substrates obtained according to said method	André Auberton-Herve, Hiroji Aga, Naoto Tate	2006-04-18
7017570	Apparatus and method for splitting substrates	Walter Schwarzenbach, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen	2006-03-28
6902988	Method for treating substrates for microelectronics and substrates obtained by said method	Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata, Kiyoshi Mitani	2005-06-07
6720640	Method for reclaiming delaminated wafer and reclaimed delaminated wafer	Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Christophe Maleville	2004-04-13
6596610	Method for reclaiming delaminated wafer and reclaimed delaminated wafer	Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Christophe Maleville	2003-07-22
6403450	Heat treatment method for semiconductor substrates	Christophe Maleville, Bernard Aspar, Hubert Moriceau, André Auberton-Herve	2002-06-11