TB

Thierry Barge

SO Soitec: 13 patents #26 of 259Top 15%
ST S.O.I. Tec Silicon On Insulator Technologies: 11 patents #16 of 155Top 15%
CEA: 2 patents #2,014 of 7,956Top 30%
SC Shin-Etsu Handotai Co.: 2 patents #282 of 679Top 45%
Overall (All Time): #149,964 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 25 most recent of 26 patents

Patent #TitleCo-InventorsDate
12278608 Method for manufacturing a substrate for a radiofrequency device Djamel Belhachemi 2025-04-15
12272540 Method for manufacturing a substrate Pascal Guenard, Marcel Broekaart 2025-04-08
12167694 Method for transferring a piezoelectric layer onto a support substrate Djamel Belhachemi 2024-12-10
12143093 Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk 2024-11-12
11979132 Method for manufacturing a substrate for a radiofrequency filter Djamel Belhachemi 2024-05-07
11870411 Method for manufacturing a substrate for a radiofrequency device Djamel Belhachemi 2024-01-09
11837463 Method for manufacturing a substrate Pascal Guenard, Marcel Broekaart 2023-12-05
11711065 Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk 2023-07-25
10943778 Method for manufacturing a substrate Pascal Guenard, Marcel Broekaart 2021-03-09
10924081 Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk 2021-02-16
10608610 Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device Marcel Broekaart, Pascal Guenard, Ionut Radu, Eric Desbonnets, Oleg Kononchuk 2020-03-31
9812371 Methods for reducing metal contamination on a surface of a sapphire substrate by plasma treatment 2017-11-07
8232130 Process for assembling wafers by means of molecular adhesion Marcel Broekaart, Bernard Aspar, Chrystelle Lagahe Blanchard 2012-07-31
8158487 Annealing process for annealing a structure Nicolas Sousbie, Bernard Aspar, Chrystelle Lagahe Blanchard 2012-04-17
7648888 Apparatus and method for splitting substrates Walter Schwarzenbach, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen 2010-01-19
7406994 Substrate layer cutting device and method Muriel Martinez, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne, Olivier Rayssac 2008-08-05
7288418 Process for treating substrates for the microelectronics industry, and substrates obtained by this process André Auberton-Herve, Hiroji Aga, Naoto Tate 2007-10-30
7235427 Method for treating substrates for microelectronics and substrates obtained by said method Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata, Kiyoshi Mitani 2007-06-26
7189304 Substrate layer cutting device and method Muriel Martinez, Alain Soubie, Chrystelle Lagahe-Blanchard, Cecile Berne, Olivier Rayssac 2007-03-13
7029993 Method for treating substrates for microelectronics and substrates obtained according to said method André Auberton-Herve, Hiroji Aga, Naoto Tate 2006-04-18
7017570 Apparatus and method for splitting substrates Walter Schwarzenbach, Jean-Marc Waechter, Thuan Truong, Bruno Ghyselen 2006-03-28
6902988 Method for treating substrates for microelectronics and substrates obtained by said method Bruno Ghyselen, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata, Kiyoshi Mitani 2005-06-07
6720640 Method for reclaiming delaminated wafer and reclaimed delaminated wafer Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Christophe Maleville 2004-04-13
6596610 Method for reclaiming delaminated wafer and reclaimed delaminated wafer Susumu Kuwabara, Kiyoshi Mitani, Naoto Tate, Masatake Nakano, Christophe Maleville 2003-07-22
6403450 Heat treatment method for semiconductor substrates Christophe Maleville, Bernard Aspar, Hubert Moriceau, André Auberton-Herve 2002-06-11