Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reclaiming delaminated wafer and reclaimed delaminated wafer

Method for reclaiming delaminated wafer and reclaimed delaminated wafer

US Patent 6720640 · Granted Apr 13, 2004

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing a substrate for a radiofrequency device2025
Method for manufacturing a substrate2025
Device architectures with tensile and compressive strained substrates2025
Method for producing a composite structure comprising a thin layer of monocrysta2025
Method for transferring a piezoelectric layer onto a support substrate2024
Substrate for a temperature-compensated surface acoustic wave device or volume a2024
Method for manufacturing a substrate for a front-facing image sensor2024
Method for manufacturing a substrate for a radiofrequency filter2024
Method for measuring film thickness distribution of wafer with thin films2024
Method for manufacturing a substrate for a radiofrequency device2024
Method for manufacturing a substrate2023
Substrate for a temperature-compensated surface acoustic wave device or volume a2023