CM

Christophe Maleville

ST S.O.I. Tec Silicon On Insulator Technologies: 38 patents #4 of 155Top 3%
SO Soitec: 11 patents #29 of 259Top 15%
CEA: 9 patents #431 of 7,956Top 6%
SC Shin-Etsu Handotai Co.: 2 patents #282 of 679Top 45%
PS Peregrine Semiconductor: 1 patents #68 of 112Top 65%
NS National University Of Singapore: 1 patents #498 of 1,623Top 35%
AS Altatech Semiconductor: 1 patents #5 of 13Top 40%
📍 Lumbin, FR: #1 of 26 inventorsTop 4%
Overall (All Time): #43,583 of 4,157,543Top 2%
56
Patents All Time

Issued Patents All Time

Showing 1–25 of 56 patents

Patent #TitleCo-InventorsDate
12218201 Device architectures with tensile and compressive strained substrates Bich-Yen Nguyen, Walter Schwarzenbach, Gong Xiao, Aaron Voon-Yew THEAN, Chen Sun +1 more 2025-02-04
12198983 Method for producing a composite structure comprising a thin layer of monocrystalline sic on a carrier substrate of polycrystalline SiC Ionut Radu, Hugo Biard, Eric Guiot, Didier Landru 2025-01-14
12100727 Method for manufacturing a substrate for a front-facing image sensor Walter Schwarzenbach, Ludovic Ecarnot, Damien Massy, Nadia Ben Mohamed, Nicolas Daval +1 more 2024-09-24
10002882 Method for manufacturing a high-resistivity semiconductor-on-insulator substrate including an RF circuit overlapping a doped region in the substrate Bich-Yen Nguyen, Frédéric Allibert 2018-06-19
9824915 Structure for radiofrequency applications and process for manufacturing such a structure Bich-Yen Nguyen, Sinan Goktepeli, Anthony Mark Miscione, Alain Duvallet 2017-11-21
9818874 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Mariam Sadaka 2017-11-14
9576798 Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers Bich-Yen Nguyen, Walter Schwarzenbach 2017-02-21
9349865 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Mariam Sadaka 2016-05-24
9219150 Method for fabricating semiconductor structures including fin structures with different strain states, and related semiconductor structures Bich-Yen Nguyen, Mariam Sadaka 2015-12-22
9209301 Method for fabricating semiconductor layers including transistor channels having different strain states, and related semiconductor layers Bich-Yen Nguyen, Walter Schwarzenbach 2015-12-08
8609514 Process for the transfer of a thin film comprising an inclusion creation step Hubert Moriceau, Michel Bruel, Bernard Aspar 2013-12-17
8470712 Process for the transfer of a thin film comprising an inclusion creation step Hubert Moriceau, Michel Bruel, Bernard Aspar 2013-06-25
8216917 Method for fabricating a semiconductor on insulator type substrate 2012-07-10
8058149 Method for fabricating a semiconductor substrate 2011-11-15
7972939 Transfer method with a treatment of a surface to be bonded Sebastien Kerdiles, Fabrice Letertre, Olivier Rayssac 2011-07-05
7956441 Method of increasing the area of a useful layer of material transferred onto a support 2011-06-07
7919391 Methods for preparing a bonding surface of a semiconductor wafer Cecile Delattre, Frederic Metral, Daniel Delprat 2011-04-05
7883994 Process for the transfer of a thin film Hubert Moriceau, Michel Bruel, Bernard Aspar 2011-02-08
7812942 Method for detecting surface defects on a substrate and device using said method Cécile MOULIN, Sophie Moritz, Philippe Gastaldo, François Berger, Jean-Luc Delcarri +1 more 2010-10-12
7749910 Method of reducing the surface roughness of a semiconductor wafer Eric Neyret, Ludovic Ecarnot 2010-07-06
7749862 Methods for minimizing defects when transferring a semiconductor useful layer Walter Schwarzenbach, Nadia Ben Mohamed, Corinne Maunand Tussot 2010-07-06
7749908 Edge removal of silicon-on-insulator transfer wafer 2010-07-06
7645392 Methods for preparing a bonding surface of a semiconductor wafer Corinne Maunand Tussot, Hubert Moriceau, Alain Soubie 2010-01-12
7615464 Transfer method with a treatment of a surface to be bonded Sebastien Kerdiles, Fabrice Letertre, Olivier Rayssac 2009-11-10
7585793 Method for applying a high temperature heat treatment to a semiconductor wafer Walter Schwarzenbach, Vivien Renauld 2009-09-08