Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142517 | Method for transferring a useful layer from a donor substrate onto a support substrate by applying a predetermined stress | Didier Landru, Oleg Kononchuk | 2024-11-12 |
| 12100727 | Method for manufacturing a substrate for a front-facing image sensor | Walter Schwarzenbach, Ludovic Ecarnot, Damien Massy, Nicolas Daval, Christophe Girard +1 more | 2024-09-24 |
| 12002690 | System for fracturing a plurality of wafer assemblies | Didier Landru, Oleg Kononchuk | 2024-06-04 |
| 12002697 | Method for detecting the splitting of a substrate weakened by implanting atomic species | Francois Rieutord, Frédéric Mazen, Didier Landru, Oleg Kononchuk | 2024-06-04 |
| 11881429 | Method for transferring a useful layer onto a support substrate | Didier Landru, Oleg Kononchuk | 2024-01-23 |
| 11876015 | Method for transferring a useful layer to a carrier substrate | Didier Landru, Oleg Kononchuk, Franck Colas | 2024-01-16 |
| 11670540 | Substrates including useful layers | Didier Landru, Oleg Kononchuk, Frédéric Mazen, Damien Massy, Shay Reboh +1 more | 2023-06-06 |
| 11424156 | Removable structure and removal method using the structure | Didier Landru, Oleg Kononchuk, Rénald Guerin, Norbert Colombet | 2022-08-23 |
| 11276605 | Process for smoothing the surface of a semiconductor-on-insulator substrate | Oleg Kononchuk, Didier Landru | 2022-03-15 |
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Ludovic Ecarnot, Christophe Malville | 2021-09-07 |
| 10950491 | Method for transferring a useful layer | Didier Landru, Oleg Kononchuk, Frédéric Mazen, Damien Massy, Shay Reboh +1 more | 2021-03-16 |
| 9922867 | Method for transferring a useful layer | Didier Landru, Oleg Kononchuk | 2018-03-20 |
| 9887124 | Method for producing a composite structure | Eric Maze | 2018-02-06 |
| 9589830 | Method for transferring a useful layer | Didier Landru, Oleg Kononchuk, Damien Massy, Frédéric Mazen, Francois Rieutord | 2017-03-07 |
| 9425081 | Method of implantation for fragilization of substrates | Carole David, Camille Rigal | 2016-08-23 |
| 8349703 | Method of bonding two substrates | Sebastien Kerdiles, Willy Michel, Walter Schwarzenbach, Daniel Delprat | 2013-01-08 |
| 8247309 | Controlled temperature implantation | Sébastien Cattet, Benjamin Scarfogliere | 2012-08-21 |
| 8088671 | Defectivity of post thin layer separation by modification of its separation annealing | Walter Schwarzenbach, Fleur Guittard | 2012-01-03 |
| 8003493 | Method of splitting a substrate | Sebastien Kerdiles | 2011-08-23 |
| 7749862 | Methods for minimizing defects when transferring a semiconductor useful layer | Walter Schwarzenbach, Christophe Maleville, Corinne Maunand Tussot | 2010-07-06 |
| 7514341 | Finishing process for the manufacture of a semiconductor structure | Eric Neyret, Alice Boussagol | 2009-04-07 |
| 7485545 | Method of configuring a process to obtain a thin layer with a low density of holes | Eric Neyret, Daniel Delprat | 2009-02-03 |
| 7465645 | Method of detaching a layer from a wafer using a localized starting area | Walter Schwarzenbach, Christophe Maleville | 2008-12-16 |
| 7326628 | Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness | Nguyet-Phuong Nguyen, Takeshi Akatsu, Alice Boussagol, Gabriela Suciu | 2008-02-05 |
| 7081399 | Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations | Christophe Maleville, Eric Neyret | 2006-07-25 |