Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261079 | Method for fabricating a strained semiconductor-on-insulator substrate | Walter Schwarzenbach, Guillaume Chabanne | 2025-03-25 |
| 12100727 | Method for manufacturing a substrate for a front-facing image sensor | Walter Schwarzenbach, Ludovic Ecarnot, Damien Massy, Nadia Ben Mohamed, Christophe Girard +1 more | 2024-09-24 |
| 11876020 | Method for manufacturing a CFET device | Walter Schwarzenbach, Ludovic Ecarnot, Bich-Yen Nguyen, Guillaume Besnard | 2024-01-16 |
| 11728207 | Method for fabricating a strained semiconductor-on-insulator substrate | Walter Schwarzenbach, Guillaume Chabanne | 2023-08-15 |
| 10957577 | Method for fabricating a strained semiconductor-on-insulator substrate | Walter Schwarzenbach, Guillaume Chabanne | 2021-03-23 |
| 10672646 | Method for fabricating a strained semiconductor-on-insulator substrate | Walter Schwarzenbach, Guillaume Chabanne | 2020-06-02 |
| 9768057 | Method for transferring a layer from a single-crystal substrate | Ludovic Ecarnot, Nadia Ben Mohamed, Francois Boedt, Carole David, Isabelle Guerin | 2017-09-19 |
| 9177961 | Wafer with intrinsic semiconductor layer | Cecile Aulnette, Bich-Yen Nguyen | 2015-11-03 |
| 9018678 | Method for forming a Ge on III/V-on-insulator structure | Bich-Yen Nguyen, Cecile Aulnette, Konstantin Bourdelle | 2015-04-28 |
| 8753528 | Etchant for controlled etching of Ge and Ge-rich silicon germanium alloys | Stephen W. Bedell, Keith E. Fogel | 2014-06-17 |
| 8367521 | Manufacture of thin silicon-on-insulator (SOI) structures | Cecile Aulnette | 2013-02-05 |
| 8183128 | Method of reducing roughness of a thick insulating layer | Sebastien Kerdiles, Cecile Aulnette | 2012-05-22 |
| 7645486 | Method of manufacturing a silicon dioxide layer | Konstantin Bourdelle, Ian Cayrefourcq, Steven R. A. Van Aerde, Marinus De Blank, Cornelius A. van der Jeugd | 2010-01-12 |
| 7531427 | Thermal oxidation of a SiGe layer and applications thereof | — | 2009-05-12 |
| 7459374 | Method of manufacturing a semiconductor heterostructure | Cecile Aulnette, Christophe Figuet | 2008-12-02 |
| 7452792 | Relaxation of layers | Zohra Chahra, Romain Larderet | 2008-11-18 |
| 7449394 | Atomic implantation and thermal treatment of a semiconductor layer | Takeshi Akatsu, Nguyet-Phuong Nguyen, Olivier Rayssac, Konstantin Bourdelle | 2008-11-11 |
| 7446019 | Method of reducing roughness of a thick insulating layer | Sebastien Kerdiles, Cecile Aulnette | 2008-11-04 |
| 7285495 | Methods for thermally treating a semiconductor layer | Takeshi Akatsu, Nguyet-Phuong Nguyen | 2007-10-23 |
| 7282449 | Thermal treatment of a semiconductor layer | Takeshi Akatsu, Nguyet-Phuong Nguyen | 2007-10-16 |
| 7276428 | Methods for forming a semiconductor structure | Takeshi Akatsu, Nguyet-Phuong Nguyen, Olivier Rayssac | 2007-10-02 |
| 7232737 | Treatment of a removed layer of silicon-germanium | — | 2007-06-19 |
| 7166894 | Schottky power diode with SiCOI substrate and process for making such diode | François Templier, Thierry Billon | 2007-01-23 |
| 7078353 | Indirect bonding with disappearance of bonding layer | Bruno Ghyselen, Cecile Aulnette, Oliver Rayssac, Ian Cayrefourcq | 2006-07-18 |
| 6991956 | Methods for transferring a thin layer from a wafer having a buffer layer | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud | 2006-01-31 |