Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430910 | Engineered substrate | Frank Dimroth, Eduard Oliva | 2022-08-30 |
| 10361326 | Advanced CPV solar cell assembly process | Rainer Krause, Frank Dimroth, Eric Guiot, Eric Mazaleyrat, Charlotte Drazek | 2019-07-23 |
| 9954139 | Multiple transfer assembly process | Rainer Krause, Eric Mazaleyrat, Frank Dimroth, Eric Guiot | 2018-04-24 |
| 9177961 | Wafer with intrinsic semiconductor layer | Nicolas Daval, Bich-Yen Nguyen | 2015-11-03 |
| 9018678 | Method for forming a Ge on III/V-on-insulator structure | Nicolas Daval, Bich-Yen Nguyen, Konstantin Bourdelle | 2015-04-28 |
| 8367521 | Manufacture of thin silicon-on-insulator (SOI) structures | Nicolas Daval | 2013-02-05 |
| 8324075 | Methods for recycling substrates and fabricating laminated wafers | Khalid Radouane | 2012-12-04 |
| 8183128 | Method of reducing roughness of a thick insulating layer | Nicolas Daval, Sebastien Kerdiles | 2012-05-22 |
| 7602046 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Bénédite Osternaud, Takeshi Akatsu, Bruce Faure | 2009-10-13 |
| 7572714 | Film taking-off method | Ian Cayrefourcq, Carlos Mazure | 2009-08-11 |
| 7544976 | Semiconductor heterostructure | Christophe Figuet | 2009-06-09 |
| 7459374 | Method of manufacturing a semiconductor heterostructure | Christophe Figuet, Nicolas Daval | 2008-12-02 |
| 7446019 | Method of reducing roughness of a thick insulating layer | Nicolas Daval, Sebastien Kerdiles | 2008-11-04 |
| 7407867 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Bruno Ghyselen, Benoit Bataillou, Carlos Mazure, Hubert Moriceau | 2008-08-05 |
| 7378729 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Bénédite Osternaud, Yves Mathieu Le Vaillant, Takeshi Akatsu | 2008-05-27 |
| 7375008 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Bénédite Osternaud, Takeshi Akatsu, Bruce Faure | 2008-05-20 |
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Bruno Ghyselen, Bénédite Osternaud, Takeshi Akatsu, Yves Mathieu Le Vaillant | 2007-08-14 |
| 7232743 | Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same | Frederic Dupont, Carlos Mazure | 2007-06-19 |
| 7232488 | Method of fabrication of a substrate for an epitaxial growth | Takeshi Akatsu, Bruno Ghyselen | 2007-06-19 |
| 7115481 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Bruno Ghyselen, Benoit Bataillou, Carlos Mazure, Hubert Moriceau | 2006-10-03 |
| 7078353 | Indirect bonding with disappearance of bonding layer | Nicolas Daval, Bruno Ghyselen, Oliver Rayssac, Ian Cayrefourcq | 2006-07-18 |
| 7033905 | Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means | Bruno Ghyselen, Bénédite Osternaud, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-04-25 |
| 7018910 | Transfer of a thin layer from a wafer comprising a buffer layer | Bruno Ghyselen, Bénédite Osternaud | 2006-03-28 |
| 7008857 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Bénédite Osternaud, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-03-07 |
| 6995427 | Semiconductor structure for providing strained crystalline layer on insulator and method for fabricating same | Frederic Dupont, Carlos Mazure | 2006-02-07 |