Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012289 | Method of fabricating a release substrate | Olivier Rayssac | 2011-09-06 |
| 7776716 | Method for fabricating a semiconductor on insulator wafer | Chrystel Deguet, Hubert Moriceau, Thomas Signamarcheix, Loic Sanchez | 2010-08-17 |
| 7602046 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Bruce Faure | 2009-10-13 |
| 7544265 | Method of fabricating a release substrate | Olivier Rayssac | 2009-06-09 |
| 7476930 | Multi-gate FET with multi-layer channel | Frédéric Allibert, Bruno Ghyselen | 2009-01-13 |
| 7449394 | Atomic implantation and thermal treatment of a semiconductor layer | Nicolas Daval, Nguyet-Phuong Nguyen, Olivier Rayssac, Konstantin Bourdelle | 2008-11-11 |
| 7378729 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Yves Mathieu Le Vaillant | 2008-05-27 |
| 7375008 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Bruce Faure | 2008-05-20 |
| 7326628 | Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness | Nadia Ben Mohamed, Nguyet-Phuong Nguyen, Alice Boussagol, Gabriela Suciu | 2008-02-05 |
| 7323398 | Method of layer transfer comprising sequential implantations of atomic species | — | 2008-01-29 |
| 7285495 | Methods for thermally treating a semiconductor layer | Nicolas Daval, Nguyet-Phuong Nguyen | 2007-10-23 |
| 7282449 | Thermal treatment of a semiconductor layer | Nicolas Daval, Nguyet-Phuong Nguyen | 2007-10-16 |
| 7276428 | Methods for forming a semiconductor structure | Nicolas Daval, Nguyet-Phuong Nguyen, Olivier Rayssac | 2007-10-02 |
| 7265435 | Method for implanting atomic species through an uneven surface of a semiconductor layer | Bruno Ghyselen | 2007-09-04 |
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Yves Mathieu Le Vaillant | 2007-08-14 |
| 7232488 | Method of fabrication of a substrate for an epitaxial growth | Cecile Aulnette, Bruno Ghyselen | 2007-06-19 |
| 7033905 | Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Yves-Mathieu Vaillant | 2006-04-25 |
| 7018913 | Method for implanting atomic species through an uneven surface of a semiconductor layer | Bruno Ghyselen | 2006-03-28 |
| 7008857 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Bruno Ghyselen, Cecile Aulnette, Bénédite Osternaud, Yves-Mathieu Vaillant | 2006-03-07 |
| 7001826 | Wafer with a relaxed useful layer and method of forming the wafer | Bruno Ghyselen | 2006-02-21 |
| 6982210 | Method for manufacturing a multilayer semiconductor structure that includes an irregular layer | Bruno Ghyselen | 2006-01-03 |