Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694991 | Method for transferring chips | Frank Fournel, Emilie Bourjot, Severine Cheramy, Sylvain Maitrejean | 2023-07-04 |
| 10438921 | Method for direct bonding with self-alignment using ultrasound | Frank Fournel, Xavier Baillin, Severine Cheramy, Patrick Leduc | 2019-10-08 |
| 9586207 | Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly | Sebastien Mermoz, Lea Di Cioccio, Thomas MAGIS | 2017-03-07 |
| 9455174 | Device and method for individual support of components | Laurent Bally, Brigitte Montmayeul | 2016-09-27 |
| 9240389 | Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone | Lea Di Cioccio, Sebastien Mermoz | 2016-01-19 |
| 8003550 | Method for revealing emergent dislocations in a germanium-base crystalline element | Chrystel Deguet | 2011-08-23 |
| 7846749 | Method and device for monitoring a heat treatment of a microtechnological substrate | — | 2010-12-07 |
| 7776716 | Method for fabricating a semiconductor on insulator wafer | Chrystel Deguet, Takeshi Akatsu, Hubert Moriceau, Thomas Signamarcheix | 2010-08-17 |