Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380648 | Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier | Jean Berthier, Nicolas Posseme | 2022-07-05 |
| 11305372 | Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials | Yann Beilliard | 2022-04-19 |
| 11121117 | Method for self-assembling microelectronic components | — | 2021-09-14 |
| 10910782 | Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen | Laurent Vandroux, Pierric Gueguen | 2021-02-02 |
| 10020283 | Direct metal bonding method | Floriane Baudin | 2018-07-10 |
| 9620412 | Method for modifying the crystalline structure of a copper element | Pierric Gueguen, Maurice Rivoire | 2017-04-11 |
| 9586207 | Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly | Sebastien Mermoz, Thomas MAGIS, Loic Sanchez | 2017-03-07 |
| 9522450 | Support for capillary self-assembly with horizontal stabilisation, fabrication method and use | Jean Berthier, Sebastien Mermoz | 2016-12-20 |
| 9431373 | Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure | Rachid Taibi, Cedrick Chappaz, Laurent-Luc Chapelon | 2016-08-30 |
| 9318527 | Method for producing photosensitive infrared detectors | Stephanie Huet, Abdenacer Ait-Mani | 2016-04-19 |
| 9240389 | Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone | Sebastien Mermoz, Loic Sanchez | 2016-01-19 |
| 9064863 | Method for directly adhering two plates together, including a step of forming a temporary protective nitrogen | Laurent Vandroux | 2015-06-23 |
| 9064783 | Method for the direct bonding of a silicon oxide layer | Chiara Sabbione, Jean-Pierre Nieto, Laurent Vandroux | 2015-06-23 |
| 9027821 | Process for direct bonding two elements comprising copper portions and portions of dielectric materials | Pierric Gueguen | 2015-05-12 |
| 8951809 | Method of transfer by means of a ferroelectric substrate | Jean-Sebastien Moulet, Marion Migette | 2015-02-10 |
| 8916393 | Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure | Rachid Taibi, Cedrick Chappaz, Laurent-Luc Chapelon | 2014-12-23 |
| 8647983 | Simplified copper-copper bonding | Pierric Gueguen, Maurice Rivoire | 2014-02-11 |
| 8642391 | Self-assembly of chips on a substrate | Francois Grossi, Pierric Gueguen, Laurent Vandroux | 2014-02-04 |
| 8501537 | Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods | Mariam Sadaka, Ionut Radu, Didier Landru | 2013-08-06 |
| 8302278 | Method and device for separating a structure | Marc Zussy, Christophe Morales, Hubert Moriceau | 2012-11-06 |
| 8093138 | Method of fabricating an epitaxially grown layer | Bruce Faure | 2012-01-10 |
| 8039370 | Method of transferring a layer onto a liquid material | Damien Bordel | 2011-10-18 |
| 7981238 | Method for relaxing a stressed thin film | Damien Bordel, Genevieve Grenet, Philippe Regreny | 2011-07-19 |
| 7960248 | Method for transfer of a thin layer | — | 2011-06-14 |
| 7538010 | Method of fabricating an epitaxially grown layer | Bruce Faure | 2009-05-26 |